Dicing processing of various wafers
Dicing processing of various electronic materials

(1)Cutting Specifications

For dicing cut specifications, we offer the best application processing according to processing quality and products.

(2)Available dicing wafer size, wafer thickness, and chip size

We can handle up to 12-inch large-diameter wafers.
We also have experience in mass production of dicing GaAs wafers of 30µ thickness.